Hrm. The board I'm thinking of making is about 3cm x 3cm in size. On one side it has a SOP14 IC, several 0603 resistor and caps, a SOD23 zener, and some SOT23 NPNs. On the other side it has 3 5050 SMD LEDs and one 0805 resistor. Hand soldering the 5050s will be rather difficult because of their proximity to each other. And the last time I tried hot air for those, I ended up with lots of failures.
I can do a skillet reflow on either side just fine. I just don't know how can I do both sides. If I do the one side with the most components, what's a good way to do the other side with the 5050s? I don't think it's safe to place the boards back on the skillet with the SMD parts down (touching the hot plate.) Thermal shock and all. And if I raise it off of the plate, even by a few millimeters, it might take longer to heat up and reflow the top and by then the bottom parts would be rewetted again ... I think.