I've built maybe two dozen boards now with FT232RL using the ChipQuik lead-free syringe from Digikey and Polulu mylar stencil. The 0805 and SOIC components come out perfect every time. But the SSOP chip (FT232) almost always has bridges. The lack of true flatness of the mylar (it is slightly curled) seems to allow the solder to squeeze laterally under the stencil while being squeegy-ed. The result is too much paste for the component, hence the bridges.
FWIW, I have found it to be quicker and easier to leave the SSOP chip off the board when reflowing, and then manually solder it. I put down a healthy layer of RMA flux from a pen-type applicator, and then carefully line up the chip with the footprint on the PCB. Tack two diagonally opposed corners, then sweep a tinned chisel-style tip across all of the pins. I've used this procedure on 3 boards now with much better results.
Jim