New Etching Method

wbegg:
I have found another method for "tinning" the circuit board after etching. Here are the steps:

  1. Clean board thoroughly
  2. Brush flux on the copper surface
  3. Using a file and a "solder slug", file a small layer of solder dust onto the board
  4. With your soldering iron on high setting, rake it across the board

This leaves a very thin layer of solder on the entire copper surface. this protects the board from oxidizing, and makes soldering the components easier. It also builds up thickness, which I'm sure enables the traces to handle higher currents?

Plus it's a heck of alot cheaper than tinning solution, or electroplating.

Cheers.

Or a layer of solder paste?