You would normally avoid putting vias inside the pads for components but even that rule is not necessary for some manufacturing processes. (The via itself is fine but it makes a drain hole so that solder can escape from under the component foot during the soldering process.)Vias under components, usually no problem unless the component must sit absolutely flat to the board, like a temperature sensor or something. If your process makes unusually thick vias, it may lift a small component like a resistor too high for proper soldering.
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