Since we're on the subject of the best soldering techniques, I am getting my hand into fine pitched ICs. I have a few 2560s that I am trying to solder. I have a syringe with solder paste and I used my hot air station. The problem I am having is that no matter what I do, I keep getting solder bridges across the pins. I use very little paste and still get bridges. I use so little solder that it barely solders the pin, but I still get bridges. I have tried not using extra flux and using a ton of it. Using more paste, still get the same result. It seems like the solder just isn't reflowing very well. I have also tried different temps.Solder paste is from Kester and is 63/37
Are you laying the solder paste across the pins? or individually on each pin? I just lay a very *very* thin bead across all the pins, and on the outer edge. (I'm using lead free solder paste.) Don't have your hot air blowing too hard... because that can push molten solder to places you don't want to (forming a bridge). Still with this technique, 2 pins out of 16 may form a bridge (SSOP-16)... then just use some flux and wick to fix it.
This is usual with manual soldering. People just take some solder wick, and wick away the bridges.
It's funny you say that. I have tried to use wick to remove the extra solder, but I can't get it suck up into the wick. The bridges are on the board crossing the pads.
The bridges are on the board crossing the pads.