1. When a trace must be connected to several components (e.g. ground) is it a good practice to put the solder point of one component in the path to another one rather than to create direct connections to each component ?
I understand it's important to have a star grounding scheme to avoid ground lifting but in other situations may I daisy chain components or should I avoid it too ?
On v2 the top layer track between Rn and Jn seems to pass awfully close to the opposite pad on Jn...
Quote from: fungus on Jan 10, 2013, 05:54 pmOn v2 the top layer track between Rn and Jn seems to pass awfully close to the opposite pad on Jn...That definitely looks too close - design-rule-check should catch this though. Personally curved tracks like thisremind me of the old days where PCB artwork was laid out by hand using strips of black crepe sticky-backedtape and a scalpel - crepe allowed the tracks to bend round without creasing.
Might the electric-field concentration at a sharp, pointy corner create a lot of radiation? Hogwash. As a trace rounds a corner, it stays a constant distance from the underlying reference plane the whole way. The electric field intensity from trace to plane doesn't radically vary at any point along this track except for a modest perturbation in the vicinity of the actual pointy tip of the corner. It's true that a microscopic electric-field probe directly adjacent to the corner would detect this field concentration. However, measurements taken from farther away account for the average of everything that happens along the whole trace, not just at the corner. The corner, because it's so small, cannot noticeably affect the far-field radiation.