I'm trying to work out how to create polygons in EAGLE that I can connect to IC pads and fill with copper for them to act as a heatsink.
I almost hijacked somebody elses thread with this question... here's what was said.
Heatsink pads - I fake those in eagle by giving the polygon pads the same name as the signal on the board drawing, then you can overlap them. Will get overlap errors when you run the DRC that you can ignore.
I have just tried it, no success. I've checked the pad I'm trying to connect my polygon to is named VCC (in this case), I've made an overlapping polygon onto this VCC pad.
I tried renaming it by Right Click > Properties > Name, but it told me to use the name command, so I did and have successfully changed the name of the pad to VCC. However, if I rename the pad to VCC and then try to fill it using ratsnest, nothing happens? The polygon just remains an empty space outlined with dashes.
If I leave the name unchanged, and click ratsnet - great, it fills it - but leaves a gap between the polygon and the pad - defeating the point of being a heatsink. Any ideas? Here's some screenshots.
1) Here's the polygon I've drawn, overlapping into the pad I want it to connect to.
2) If I don't rename the pad, and just click ratsnest - I get this, filled - but a gap.
3) If I rename the polygon to the same as the pad, click okay, then click ratsnest - and... it just looks the same. No fill.