We can try a few things. Yes we can try to hand solder the micro-SD socket. We might be able to reflow the mocro-SD socket first, then flip it over and reflow the rest, with suface tension holding the bottom part on. I don't think that will be feasible, though. Because reflowing the top measn using the stencil and squeegie to apply the paste and I doubt we can do that with the micro_SD part applied.
Maybe the trick will be to reflow the top, then use the hot air rework station to apply the bottom parts. As I think about it that might be best, although we'll need to be careful to apply just enough heat in just the area we need, so the parts on the other side stay put.
As for the order of parts, most recomendations I have read are to put the big ones on first followed by smaller ones. I have found with only a few exceptions, it does not make much difference. My board has a few spots where that is better though. I make a checklist, have an enalrged gerber next to me, use a few magnifiers and its off to the races! The checklist is key though.