Nice. Some tweaks I'd recommend though:C3 is very large.It would usually be sized at least 10 times larger than the MOSFET input capacitance, and at least 10 times smaller than the decoupling cap on the driver chip. 220nF is usually enough for most cases. It should beceramic multi-layer, not electrolytic or film.Its usually a good idea to add a 10 ohm or so resistance in series with the bootstrap diode to limit currentspikes through it - then the shottky diode can be a much smaller physically (esp with surface mount).The 10uF decoupling cap for the driver chip really needs to be ceramic, right up close to the chip - electrolytic isbasically not doing much useful decoupling at the speeds the chip switches, so that there will be more noise and spikes on the 12V supply than is necessary - ultimately this can cause the chip to fail as Vcc is sensitive to overvoltage. These chips switch large currents (upto amps) at rates measured in 100's of amps per microsecond, good decoupling and low stray inductance are important.Similarly C2 would be better as a large value MLCC (although they are expensive), not an inductive filmcap.