NA
I'm not entirely sure but I think the TH & TW refer to the packaging the device is supplied in/on by the manufacturer. I know devices can be supplied on tape and reel (for pick & place machines), in trays etc. They are all the same physical device just supplied in different outer packaging (not to be confused with the physical device package tyoe).
Any use ? You might find device signatures vary with part number which may upset uploading with the IDE
http://db.zmitac.aei.polsl.pl/Electronics_Firm_Docs/ATMEL/Atmel/acrobat/doc0538.pdf
design_:
Can any one suggest what package change cause we unable to get the results, is there any difference between both.
References.
Since you have both devices, why dont you tell us what the difference between them actually is ?
Different packages, if so which ones ?
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