I have a particular project where I am wishing to be able to hotswap connect up to (or maybe more than) 100 devices.
They are all square and communicate off of each side with each other and a master device.
I have had some success with pogo pins and pads on each side and using EasyTransferI2C to get data through to the master.
I am now at being able to connect 5 tiles. Which sometimes doesn't quite work if I don't connect the intterupt and data pins in close-enough time. I see that this could be corrected with a message confirmation routine.
BUT. I'm also starting to wonder about whether parasitic capacitance is going to creep into this system.
Currently all four sides are connected to A4/A5.
I am pondering whether I should try to use other pins for separate softwareI2C data (read somewhere that the clock can be common).
I see that the ESP8266 WiFi can have 20 devices connected together at a time. So would have to create the ability in my devices to jump networks to get to 100+ devices.
So I've come to infrared and passing data through as an option.
And, on noticing that exists this project guidance forum, I am curious what those with experience in these matters thinks might be the better physical layer to use?
Summary of layers considered:
- ESP8266 WiFi - read up. 20 devices can mesh at once
- I2C - using pogo pins and seeing that sometimes it doesn't fully connect. Worried about parasitic capacitance in the future
- IR - This, while a bit slow and heavy on power, seems like the right answer. But no current IrDA protocol baked into IRLib nor IRRemote
What do you think?
Cheers,
/A