I made a mistake ordering and got 60 of the 0.025" pin spacing devices. I can solder the 0.05" devices, but not these teensy tiny ones.
First claimant who can be reached by US Postal gets them. Or the trash.
I use these all over the place for byte-wide and word-wide data interface.
Dr.Q
The 'mistake' seems not wanting to learn to solder smd stuff.
Soldering those chips with solder paste and a hot-air wand is easy.
And there are adapter boards (to 28-pin DIP) for those chips.
Leo..
I can take them 
Tho I encourage to try soldering them, it's not that hard, the key is enough flux. I solder LQFP with ~0.018" spacing with my huge cheapo soldering iron with no problem.
A. I don't need smaller boards
B. I already have designed my own adapter boards
C. I'm generally up to my butt in alligators, so my 60 years of soldering technique is pretty fixed; I'm proud enough of doing 0.05" lead spacing
thanks
Dr.Q
60 chips... Must do some large projects then.
There is no real through-hole replacement for complex chips anymore, so learning to solder chips with that pin spacing is a must if you want to keep up.
Many of us 60+ or even 70+ dudes (almost 67 here) eventually don't seem to have problems with that.
Just needs a bit of practicing.
I mainly use stencils, solder paste (not flux) and the hot-air rework station, but I also drag-solder (with flux), or use the reflow oven.
Leo..
Leo, I had to smile reading your post. So I'll give you an expanded Luddite-ish reply.
When I was building the B-2, I had a chief engineer who taught me that "better was the enemy of good enough." I took his mantra to heart and as a result have had many subsequent programs that were much more cost effective.
I build hardware only to satisfy my need for a place to install my firmware. I am a controller developer, and these controllers (lights, heat, water, security) only go into my house and shop. I don't need to swallow them or reduce weight so they can go into orbit. They also don't need to be more complex than an Arduino with maybe a few more I/O pins. Which brings up the idea that maybe a Mega would be more cost effective than a Nano with a piggyback 9555, but not if you already have the enclosure for the Nano and a 9555 daughter board fills the bill.
I took a look at FPGAs a couple years back and decided I didn't need to go there! That cured me of much interest in "complex" chips.
Best to all you guys who are hanging on at the tip of the spear. :o
Dr.Q
Not sure what the actual problem is.
The trend is SMD. Through hole only will stay for some power/size related parts.
There are many parts, like the PCA9685, that you can't get in DIL/through-hole anymore.
If you're still designing for through-hole, and mainly use a soldering iron, then you will eventually find yourself on a dead-end track.
Leo..
Chee, give man a break...
He wrote his arguments, stop being fan boys and get over it.
Everyone has his preferences.