How easy is it to burn components when soldering w/ hot air?

Hello, I have a PCB that has an ESP32-D0WD-Q6 QFP chip and I am worried that I will burn it while using hot air to solder it on the PCB. Are components like the ESP32-D0WD-Q6 really easy to burn or are most components able to withstand high amounts of heat for a short period of time? Thanks for you time.

Just build a set of temperature profiles based on temp & time

https://www.johansontechnology.com/soldering-profiles-and-guidelines-for-smt-ceramic-components

You can find the Espressif info in the datasheet

You can use a foil shield to protect components while hot air soldering and desoldering.
@LarryD can provide a much more detailed answer.

The nozzle of your hot air soldering gun must be small enough so the hot air ONLY goes on the pins!
Paul

Yes, there is really no way to do it with a heat gun, that won't compromise the chip. In the factory, the reflow temperature is tightly controlled in both temperature and time.

Also the uneven heating of a gun, introduces differential temperatures that stress the PCB.

Thanks for all the info guys.

Hot air rework stations use a thermocouple in the airstream to accurately control the air temperature - its essential to use a temperature that won't cook the board, which often means you have to wait for a couple of minutes for the board to come up to the air temperature - trying to rush by increasing the air-temperature too high will lead to burning the board, so just be patient. Use the largest nozzle you can so that more of the board heats up and the airflow is less violent (small nozzles can lead to components being blown off the board!)

And use lots of flux, the components should be swimming in it.

We used to call that, "air hockey".

a real puck up?

5 minute penalty for you.