I am working on a project which will require 3 IIC devices, which are tiny chips conveniently placed on a module/breakout board.
BMP180 sensor breakout has 4.7k pull-ups (472) [UPDATE : It seems like I do not get any resistance between SDA & VCC so I assume they are not connected]
Si7021 sensor breakout has 10k pull-ups (103)
TSL2561 has 4.7k pull-ups (472) [UPDATE : It seems like I do not get any resistance between SDA & VCC so I assume they are not connected]
If I use them then I will get a parallel resistance of 1.9k
I also have a couple of TXS0108E logic level converters laying around (full duplex conversion), which I plan to use with my IIC devices and Arduino, since I might be adding 5V devices in future.
My questions are :
- Are those pull-ups going to destroy all of my IIC devices on the bus and the logic level converter chip ?
- Is there any way to get around without soldering ? The chips are kinda expensive to import, and I am not very skilled at smd resistor desoldering.