Answer from Microchip/Atmel:
The specification 200 mA max is for each pair of the VCC-GND pin. If a package has 2*VCC/GND then it will be 400mA.
Bonus question:
"It is need for ATmega2560 use heatsink? "
If the device is operating within the datasheet specifications, the device should not heat up and hence heatsink is not required.
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My answer (not counting AVCC):
Uno DIP: max. 200 mA (1x VCC/GND)
Uno/Nano SMD: max. 400 mA (2x VCC/GND)
Leonardo/Micro: max. 400 mA (2x VCC/GND)
Mega 2560: max. 800 mA (4x VCC/GND)
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Why do some pinout images from BQ and Pighixxx show max. 200 mA only?