Arduino resistance to heat exposure

Other Hardware 3rd Party Boards
1

So I have a few sheets of 1 mm thick plexiglass that is meant for putting in a heated vacuum mold to stamp it with a press to have it evenly take the shape.

Instead of using that type of machine I just used my heat gun with a hole inside a box that I put the tip in, I would like to encapsulate my PCB and modules inside the seamless type of shell do I have to make mock up placeholder dummy parts and then Crazy Glue two halves together with the real Parts in.

Or can I just form this Plexi directly over the parts?

Also would be generic insulation canned spray foam or the weather sealant spray foam you can get in the generic hardware stores have sufficient ESD prevention characteristics to just use that instead.

2

The data sheet will tell you the maximum temperature it will tolerate. Exceed that and it may start its journey on a terminal problem called fried. If the foam is not expressly marked for static suppression I would assume it will test the ZAP capability of whatever you put in it.

3

The storage that we're talking about in this section is EEPROM, SD and so on; not storage of your product in a box :wink:. Hence your topic has been moved to a more suitable location on the forum.

4

Opps, apologies.

5

This topic was automatically closed 180 days after the last reply. New replies are no longer allowed.