I came across this idea on YouTube.
The author's skill set is horrible at the process but the idea is interesting.
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he doesn't show the pads after he is done.. I bet half of them are ripped up, especially with such a fine pitche part..
I wonder if he realizes just how much of that heat he's pouring into that loop is getting sucked up by those pliers clamped so close?
A method I use for removing chips like that is to use solder wick once around, then feed a 26 ga stripped wire just behind the pins on one side and secure one end to a nearby feed-thru. Holding the free end tight I apply a fine point solder iron to the pin and gently pull the wire until it pulls out under that pin. Repeat for the rest of the line and on around to all the other sides. After the chip pops off I apply solder wick to the pads to clean them up. It takes a few minutes but I have never loosened a land or shorted them together.
Euch! - you're right - a nasty process. Don't try this trick on PTFE substrates!
you could cut all the pins with fine wire cutters then remove all the debris with solder wick.....
regards
Allan
If you haven't got a (hot air) rework station, then you shouldn't mess with smd.
Leo..
If you must do it that way, you should definitely be using the magic desoldering solder - it's got stuff that forms a low melting eutectic with the solder, so you don't have to get it as hot or hold it at such a high temperature.
I can't imagine the pads come out of that in good shape at normal soldering temperatures...
Look at chipquik also
http://www.chipquik.com/store/index.php?cPath=200
Alters the original solder to make it easier to keep all pins heated at the same time so a chip can be removed.
Hot air is far more reliable. That method looks like even if it works it leaves loads of solder
on the pads which you'd then have to remove anyway. For SMD too much solder is bad news,
as little as you can get away with and lots of flux...