I have a prototype that has an nRF24L01 RF module. I have serious problems with ESD. To increase ESD immunity of the PCB, I have some ideas.
Pcb is inserted into shelf of an aluminum chase. I thought to ground chase is a good solution for RF immunity for nRF24L01( like faraday cage / RF shield). Therefore, I have left the right and left edges of the PCB as pads as you can see in the figure below. I am convinced that RF immunity and RF performance of the module is boosted. And, I have decided to place a small aluminum RF shield which only closes the nRF24L01 module on the PCB. Therefore, if ESD immunity is increased, I remove these grounding pads.
Shortly, Does grounding aluminum chase boost ESD immunity?
- There is a 1x8 PCB header connector in the middle of the front edge of PCB. However, some pins in the connector go directly to MCU. Therefore, after removing this connector and hole for the connector, the PCB is isolated from the environment.
Does leaving no naked pins to help ESD immunity?
At this moment, Is ESD test conducted by spark gun on directly on the PCB or the product which used by end user?
Thank you for your contributions in advance