I am considering integrating the Nano IoT33 into a custom-designed PCB using the Surface-Mount Device (SMD) method, specifically through a hot plate technique. I am curious about the feasibility of this approach.
Is it possible to mount the Nano IoT33 using the SMD hot plate method, or is it necessary to employ a through-hole mounting technique for this specific module?
The castellated connections on the edge of the board will allow you to do what you describe. Be very careful when the PCB and board are on the hot plate as all of the components of the board will be heated and could move
Personally I would be inclined to manually solder the connections individually to keep the heat local to each pad
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