PCB design GROUND plane

Hi, everyone . I asked a lot in this forum and you guys helped me. I want to say thank you. I got work my project on breadboard and then, I designed a PCB with pin headers. I want to make one more step and I want to make PCB with ICs and SMDs. I already did, I did my schematic and connection side. I left only ground connections.

First, I want to ask you. My system is working with PCB which is pin headers. I made this PCB. It is 2 layer board and I used 2 ground plane. Now I am afraid for these ground things. This system is working with ground polygon and it is working. If I use ground for every component again, will it work ? I know it is important for emi/emc . I looked google a bit.

I am working with DC voltage. I am using 1 switching regulator and 1 LDO. (I read switching regulator have some problems with ground plane). My system using stepper motor driver (3 signal pin), one load sensor (it has own analog supply) , 1 ethernet module ( I used ferrite beat for clean analog supply and I separate RJ-45's ground with 1nF/2kV cap) and 1 relay module.

I looked my microcontrollers design (Adafruit, Sparkfun) and all of them used ground plane top and bottom.

  • What should I do ? Should I use 2 polygon top and bottom and use GND via around PCB?

  • I am really confused about GND. Should I form my ground myself with wire and by one by (8 mil for signal and for powers bigger.)?

Hi,

Glad to see you have a working project.

I think there is something lost in translation with your question.
What do you mean "use ground for every component again".

Can you please post EXPORTED jpg of your PCB pattern?

Thanks... Tom.... :grinning: :+1: :coffee: :australia:

Sorry I mean , I used 2 polygon for my first PCB. System is working with 2 polygon GND. I didn't connect GND's and I didn't use polygon for my IC design. U1 has GND. U1 has central GND pad. Here is photo:

Vias for power and signals.

I delete it because ı though there are problem.

Hi,
Have you measured with a DMM if they are already connected via a component lead?

You didn't use polygon but it is working with polygon.
I can't see your polygons.
Can you post an image of top layer with silk screen and a separate bottom layer image.

Thanks.. Tom.... :grinning: :+1: :coffee: :australia:

No , I couldn't explain myself I guess. This one has no polygon. This is new. I did PCB with pin headers (for example I used directly Arduino nano , W850io et). I am using this pin header PCB sicne 4 months. I posted new one , I am trying to make this with ICs and SMDs. Old one (Pin header PCB) was working when it has 2 polygon.

Hi,
As long as you have ALL gnd connections connected together you should not have a problem.
Can you please post the schematic of your new project?

Tom... :grinning: :+1: :coffee: :australia:

If you have SMT fast logic chips use a groundplane on the bottom side always. The signals on the topside need a ground return path close by and the ground plane provides this. If you circuitry is slow (like audio amplifier), a groundplane is not required (but you probably need star-grounding in that particular situation).

Power traces should be wider to reduce stray inductance, and ensure every supply pin to every IC has proper decoupling close to the IC.

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