PCB Design Feedback Request: ESP32, SIM808, and Sensor Integration

[achraff-fli]

Hello everyone,

I'm working on a 4-layer PCB design and would appreciate any feedback or recommendations you might have. Here are some key details of the design:
Microcontroller: ESP32-C3FH4 for control and communication
GPS/GPRS Module: SIM808, with SIM card support
Sensors:
• MLX90614 for temperature measurement
• MPU-9250 for acceleration sensing
• APDS-9960 for proximity detection
Power Management: TP4056 module for LiPo battery charging and seamless switching between USB, battery, and external power
Antenna Connections: Separate GSM and GPS antennas for the SIM808

Layer Configuration:

4-Layer Stack:
• Top Layer: Signal
• Inner Layer 1 : Power
• Inner Layer 2 : Ground
• Bottom Layer : Signal

Design Goals and Specific Areas for Feedback:

1. Power Supply Stability: I'm particularly concerned about ensuring stable power to the SIM808 module. The power circuit includes components for USB/battery power switching. Any suggestions on component selection, layout, or decoupling for power stability?
2. Power Consumption Optimization: I'm exploring power-saving features such as ESP32 deep sleep. Would love advice on component adjustments or layout techniques to reduce overall consumption.
3. I2C Communication Reliability: This design involves multiple I2C devices connected to the ESP32-C3. Feedback on pull-up resistor values or tips for improving I2C communication stability would be very helpful.
4. Antenna Placement and Routing: Since I have GSM and GPS antennas for the SIM808, I want to ensure optimal placement and minimal interference. Any best practices on antenna layout, ground plane isolation, or signal routing?

I've attached the schematic and PCB layout below. Looking forward to any insights you can provide to help make this design more robust and efficient.

Thanks in advance for your help!
schematic

Top Layer and Bottom Layer

inner 1 and inner 2

[jim-p]

Why are there component pads on the inner layers?

[achraff-fli]

The component pads on the inner layers are used for via stitching and thermal management.

[jim-p]

Component pads are not used for via stitching or thermal managemrnt, besides they are causing short circuits with traces on the innerlayers.

Maybe you should first spend some time learning how to use EasyEDA.

[maikarg]

Whats the difference with your previous design?

Requesting Feedback on PCB Design

Hello everyone, I’ve been working on a PCB design for my project, and I would appreciate any feedback or recommendations you can offer. The design includes: ESP32-C3 for control and communication SIM808 module for GPS and GPRS with SIM card support MLX90614 for temperature measurement MPU-9250 accelerometer APDS-9960 proximity sensor Power management using TP4056 for LiPo battery charging and switching between external power and battery I've attached the schematic and PCB layout below. I am …

[jim-p]

@achraff-fli

Looking forward to any insights you can provide to help make this design more robust and efficient.

Don't use net ports to connect nets on a single page, they are intended for Hierarchical designs. Direct connections with wires are prefered with limited use of net labels.

[jim-p]

As @maikarg pointed I see I just wasted my time replying as you already have an identical topic already open. You are not supposed to have two identical topics open.
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[achraff-fli]

@maikarg

Whats the difference with your previous design?

In the previous design, all four layers were combined in a single image, which made the information dense and potentially harder to interpret. In the new design, we separated these layers into two images, with each image containing two layers. This allows for a clearer segmentation of information and visually guides users through each level of analysis or interaction, making it easier to understand.