Portenta H7 : thermal analysis

A pretty "cool" board, this Portenta H7 MCU module. Fully packed with a lot of chips and features.
I was a bit skeptical about heat generation (dissipation) when I use many features at the same time and full speed running all in parallel.

So, I run my FW with:
ETH (network traffic), USB-C for UART messages, run SDRAM test - in parallel
(not used: WiFi/BT, QSPI flash, Crypto chip).

Here the results (thermal camera picture, taken with a human body scan camera, therefore hot is out of range):

BTW:
This is WITH a (passive) heat sink on MCU chip already.

My conclusions:

  • it should "survive" my use case (using heat sink on MCU and with the breakout board) - MCU might reach 55C (OK, rated for ambient 85C), I need just Power (PMIC), USB-C, ETH, SDRAM, MCU

  • heat travels a bit also to breakout board (with large thermal resistance), potentially via high-density connectors and infrared radiation) - assume: breakout board does not contribute really for cooling so much. But it gets warmer as well (maybe +5..10C above ambient temperature).

  • if you use the Portenta H7 MCU module itself (without heat sink, without breakout board) and using all the features (ok: ETH not usable, but also with WiFi/BT and QSPI, Crypto) - the board temperature could reach 60C, the MCU maybe 70C - but still OK (85C rated as all the other chips should be, at least 80C).

Improve Cooling

  • place a (passive) heat sink on MCU chip (might help for -10C lower)

  • if you can: solder the headers left and right: even not used - they provide additional cooling (for the entire board)

  • the PMIC (power controller IC, the most second hot chip) and ETH controller (the hottest chip on board), USB-C chip - are too tiny in order to provide a heat sink for those. WIFi/BT plus SDRAM plus QSPI flash - maybe a shared heat sink possible

Anyway. I am a bit surprised (in a positive way):
I was expecting much more dramatic temperatures on this tiny board. But it looks OK.
Just: if I run the board all the time with 70C on MCU, maybe entire board with 60C (and even all not used chips are heated up to 60C) - the life span might degrade a bit.

With full load - you can burn your fingers on MCU chip (I can touch with heat sink barely). If you place this board in enclosure - make sure to have a proper (passive or even active) ventilation.

But OK, I am fine with the thermal analysis. Pretty "cool" board.

Here a picture with heat sinks installed (as much as possible).
Better, but still pretty warm.
I guess: heat distribution over entire board more equally now, avoiding hot spots on
particular places (chips) and solder pads (chips can crack with uneven heat distribution).

General impression (with the head sinks):
the board needs heat sinks - all are remarkable hot. I cannot imagine w/o heat sinks it would be "good".

All the yellow copper heat sinks down to: 41.8C (esp. for MCU)

BTW: without heat sinks: I got one error on SDRAM test - gone now.