Hot Plate or Reflow Oven?

So far I use hot gun to solder smd components. I want to start using a hot plate or Reflow Oven so that the soldering process is faster. I have never used a Hot Plate nor a Reflow Oven before and I wonder which one is safer for esp32 and other components? Also I have no idea how to solder 2 layer PCBs as when I solder components in one side and I start soldering the other side, the components from the 1st side will disconnect and fall. Please share your experience and advices. Thank you.

Basically the soldering of two sided circuit boards are done with very close control of temperatures. Soldering the second side of a circuit board relies on the surface tension of the molten solder to hold the components in place. Too hot and the surface tension becomes too weak to hold the component.
In addition, any vibration will shake the component loose from the board.
If you can overcome the problems, you will need to device a way to support the board while soldering the second side. You do not want the components to come in contact with the hot surface.
Advice to study the data sheets for all components and see if the heating/cooling times will work for your plan.

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If you are doing double sided, the plate will not work, you need the oven.

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  • For DIY hobbyists, the components on, let’s call it the foil side, are soldered by hand.

  • I now only use a hotplate or hand solder PCBs.
    Some components like potentiometers can be damaged by an oven.
    Personally, it makes no sense to heat everything to soldering temperatures, I prefer to just heat the component leads.

  • How many boards will you be making per run ?

  • Here is how I hand solder ESP32s:

  • Here is how I hand solder SMDs:

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Thank you for the explanation. I am planning to solder 10 PCBs for this time but if everything goes well with the project, I may have to deal with 100 PCBs or more.

How about a SMD adhesive?

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Can you point me at an explanation of how/when to use these?

SMD adhesives are used when the devices will be upside down, as in wave soldering.
It is applied before the soldering to the case of the device. It is a heat resistant glue.

Sometimes I want to use a rework air gun but the small SMD can be blown away. This sounds like a fix for that. I don't own a hot plate or oven yet.

MAny people have successfully used electric fry pans and toaster ovens.

Don't own either, and no room in my room.

Can you vent the fumes from a small reflow oven?

  • There are two sizes of this hotplate, they are small but effective.

I didn't know that something like SMD adhesives existed. Thank you for this info.

Don't ever use adhesives on AMD devices that use a belly pad for heat dissipation. It must be soldered.

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